BIGCOM 2023

General Co-Chairs

Xiaoming Fu, Georg-August-University of Goettingen, Germany
Yusheng Ji, the National Institute of Informatics, Japan

TPC Co-Chairs

Xiaowen Chu, The Hong Kong University of Science and Technology (Guangzhou), China
Xianpeng Wang, Hainan University, China
Jiahui Hou, University of Science and Technology of China, China

Local Arrangement Chairs

Ting Jin, Hainan University, China
Di Wu, Hainan University, China

Publicity Chairs

Ruiting Zhou, Southeast University, China
Zichuan Xu, Dalian University of Technology, China
Yupeng Li, Hong Kong Baptist University, Hong Kong, China
Tao Li, Indiana University-Purdue University Indianapolis, United States

Publication Chairs

Xin He, University of Science and Technology of China, China
Haohua Du, Beihang University, China

Industry Liaison Chairs

Haisheng Tan, University of Science and Technology of China, China
Chenren Xu, Peking University,China
Qiang Li, USTC-Deqing Alpha Innovation Institute, China

Finance and Registration Chairs

Ludi Xue, University of Science and Technology of China, China
Luying Chen, USTC-Deqing Alpha Innovation Institute, China

Web Chairs

Qi Song, University of Science and Technology of China, China
Shuli Zeng, University of Science and Technology of China, China

Program Committee

Zichuan Xu, Dalian University of Technology, China
Zhuzhong Qian, Nanjing University, China
Zhi Zhou, Sun Yat-sen University, China
Zhenhua Han, Microsoft Research Asia, China
Zhenchun Wei, Hefei University of Technology, China
Zhen Ling, Southeast University, China
Zehua Guo, Beijing Institute of Technology, China
Yupeng Li, Hong Kong Baptist University, Hong Kong, China
Yong Xiao, Huazhong University of Science and Technology, China
Yijing Zeng, Meta, USA
Yifei Zhu, Shanghai Jiao Tong University, China
Yi Zhang, Xiamen University, China
Xiaozhen Lu, Nanjing University of Aeronautics and Astronautics, China
Xiaoxi Zhang, Sun Yat-sen University, China
Wenting Wei, Xidian University, China
Wang Ning, Chongqing University, China
Song Yang, Beijing Institute of Technology, China
Siguang Chen, Nanjing University of Posts and Telecommunications, China
Shigeng Zhang, Central South University, China
Shaohuai Shi, Harbin Institute of Technology, Shenzhen, China
Shang Gao, Jilin University, China
Qiang Ye, Memorial University of Newfoundland, Canada
Qiang Wang, Harbin Institute of Technology, Shenzhen, China
Qian Ma, Sun Yat-sen University, China
Qi Song, University of Science and Technology of China, China
Pan Zhou, School of Cyber Science and Engineering, Huazhong University of Science and Technology, China
Liyao Xiang, Shanghai Jiao Tong University, China
Lin Cui, Department of Computer Science, Jinan University
Huawei Huang, Sun Yat-sen University, China
Haohua Du, Beihang University, China
Hao Zhou, University of Science and Technology of China, China
Haipeng Dai, Nanjing University, China
Haiming Chen, Ningbo University, China
Geng Sun, Jilin University, China
Feng Shan, Southeast University, China
Fangxin Wang, The Chinese University of Hong Kong, Shenzhen, China
Dian Shen, Southeast University, China
Dan Tao, Beijing Jiaotong University, China
Chengjian Liu, Shenzhen Technology University, China
Chang Shan, Donghua University, China